http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101013678-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0007 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 |
| filingDate | 2007-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101013678-B1 |
| titleOfInvention | Photosensitive resin composition, the method of forming a resist pattern, the manufacturing method of a printed wiring board, and the manufacturing method of the board | substrate for plasma display panels |
| abstract | (A) The weight average molecular weights are 35,000-65000 binder polymer, (B) photopolymerizable compound which has an ethylenically unsaturated bond, and (C) photoinitiator, (B) component is (B1) ethylenically unsaturated bond A photopolymerizable compound having one, a (B2) photopolymerizable compound having two ethylenically unsaturated bonds, and (B3) a photopolymerizable compound having three or more ethylenically unsaturated bonds, wherein (B3) ) Photosensitive resin composition whose ratio with respect to component whole quantity is 15-30 weight%. |
| priorityDate | 2006-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 90.