| abstract |
Disclosed are a copper foil for a chip-on film, a plasma display, or a high frequency printed wiring board, obtained by rolling a copper foil and smoothing the surface to have a surface area of 1.30 times or less of an ideal smooth surface. Copper, or alloy particles of copper and molybdenum, or alloy particles composed of at least one element selected from copper, nickel, cobalt, iron, and chromium, or at least one selected from the alloy particles, vanadium, molybdenum, and tungsten in the smoothed copper foil. Fine-tuned particles, which are a mixture of an oxide of an element of, are deposited on the smoothed copper foil surface to produce a copper foil for a chip-on film, a plasma display, or a high frequency printed wiring board. n n n n Copper foil for chip-on film, plasma display, or high frequency printed wiring board |