| abstract |
A solder paste obtained by mixing a Cu-based metal powder and a Sn-based solder powder having a solidus temperature of 400C or higher with a solidus temperature of 250 ° C or higher to replace the package and the lead of the functional part, and having excellent solderability. I pre-plated embodiment (難) obtained by coating and heating the lead in the solder material, the solder layer composed of a Cu-based metal powder and the compound and lead-free solder between the metal of the Cu 6 Sn 5 in the plated surface. Such a solder layer functions as a high temperature solder, because the intermetallic compound is bonded to the non-solder material and the intermetallic compounds are connected, while the high temperature solder is not good in solderability. Can be avoided.n n n n Leads for functional parts |