| abstract |
By introducing a vinyl group at the terminal of the bifunctional polyphenylene ether oligomer, a vinyl compound having excellent heat resistance and electrical properties and excellent reactivity, and a high glass transition temperature, low dielectric constant and low dielectric loss tangent, and excellent polyphenyl There is provided a cured product thereof with ene ether. n n n Vinyl compound, heat resistance, dielectric constant, curing, photosensitive resin |