| abstract |
An electronic substrate manufacturing method of the present invention comprises the steps of (A) selecting a first base layer, (B) depositing a first etchant resistance barrier layer on the first base layer, and (C) an alternate conductive layer And building up a first half stack of insulating layers, wherein the conductive layers are interconnected by vias through insulating layers, and (D) applying a second base layer on the first half stacks. (E) applying a protective coating of photoresist on the second base layer, (F) etching away the first base layer, and (G) removing the protective coating of the photoresist And (H) removing the first etchant resistance barrier layer and (I) building up a second half stack of alternating conductive layers and insulating layers, the conductive layers passing through the insulating layers to the vias. Interconnected by the second half stack and laid up substantially symmetrically with the first half stack, (J) applying an insulating layer on the second half stack of the alternating conductive layer and the insulating layer, (K) removing the second base layer, and (L) an outer surface of the stack Exposing the via end of the phase to apply an end.n n n n Electronic substrate, base layer, barrier layer, stack, via, photoresist, protective coating |