http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100981396-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L15-00 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J109-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L21-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J109-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00 |
| filingDate | 2007-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2010-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100981396-B1 |
| titleOfInvention | Adhesive paste composition for semiconductor package |
| abstract | The present invention relates to an adhesive paste composition for a semiconductor package. The adhesive paste composition for a semiconductor package according to the present invention is characterized by using a mixed resin in which an elastic resin and an epoxy resin are blended as a basic resin. At this time, the elastic resin constituting the base resin is 50 to 95% by weight, the epoxy resin constituting the base resin is preferably 5 to 50% by weight. According to the present invention, the performance of the die adhesive is expressed as it is without the preliminary drying process and the thermal curing process to be performed after the application by screen printing to the member to be bonded using the die adhesive as a separate process step, Therefore, there is an advantage that can present a simpler process that can maintain the reliability of the quality of the semiconductor product manufactured.n n n n Thermosetting, Adhesives, Curing, Drying, Packaging, Die |
| priorityDate | 2007-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.