http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100979281-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cc314628353d904f2a9af069d6347fef |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65D2313-00 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65D81-265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B65D85-50 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14 |
| filingDate | 2010-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2010-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e026c5849f9a359af7d139c24d9e04cf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec76891fd4bb84b5cb66e9afe87a3a60 |
| publicationDate | 2010-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100979281-B1 |
| titleOfInvention | Manufacturing method of conductive powder |
| abstract | The present invention relates to a conductive powder in which a multilayer nickel plating layer and a reducing gold plating layer are sequentially stacked on a core material surface of a synthetic resin material, and more specifically, a base nickel plating layer is laminated on a core material by plating nickel on the core material. Forming a single layer nickel plated powder, plating a nickel layer on the single layer nickel plated powder to form a multilayer nickel plated powder in which an upper nickel plated layer is laminated, and plating a gold plated layer on the multilayer nickel plated powder. Forming a plated metal plating powder, and the nickel plating layer is formed in multiple layers so that the nickel plating layer is not peeled from the core material when the gold plating process is carried out so that the gold plating process is normally performed and the conductivity is maintained as it is used, and only by the substitution gold plating solution. Conductive powder with gold plated layer uniformly formed by gold plating Provided are methods for preparing a sieve. |
| priorityDate | 2010-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 64.