http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100978651-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4629 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate | 2007-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2010-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100978651-B1 |
| titleOfInvention | Low Temperature Simultaneous Ceramic Substrate with Buffer Layer and Its Manufacturing Method |
| abstract | The present invention relates to a low temperature co-fired ceramic substrate having a buffer layer for preventing cracking due to a difference in thermal expansion rate in a heterojunction region and a method of manufacturing the same.n n n According to the present invention, there is provided a method for manufacturing a low-temperature cofired ceramic substrate, comprising: providing a first ceramic layer on an upper surface of a carrier film; Forming a plurality of polymer patterns on an upper surface of the first ceramic layer; Providing a laminated structure including a base material layer surrounding the polymer pattern and a second ceramic layer formed on an upper surface of the base material layer; Burning out the polymer pattern to form the base material layer as a buffer layer including a plurality of holes; After removing the carrier film, forming a plurality of ceramic layers having at least two electrode patterns formed on one surface or both surfaces in an upper direction or a lower direction of the buffer layer; And baking at low temperature, including the buffer layer and the plurality of ceramic layers.n n n According to the present invention, it is possible to provide a low-temperature cofired ceramic substrate in which a stress due to a difference in thermal expansion of each of the first ceramic layer and the second ceramic layer is buffered by structural features in a buffer layer having a plurality of holes.n n n n Hole, buffer layer, low temperature cofired ceramic substrate, thermal expansion |
| priorityDate | 2007-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.