| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fa80eed27901ac84139c7a7109c21e17 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-167
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0093
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-382 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 |
| filingDate |
2010-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2010-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17323325080eacd5af10c289d5b0614b |
| publicationDate |
2010-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100974787-B1 |
| titleOfInvention |
Light emitting device, light emitting device manufacturing method and light emitting device package |
| abstract |
The present invention relates to a light emitting device, a light emitting device manufacturing method and a light emitting device package. The light emitting device according to the embodiment includes a light emitting structure layer including an active layer between the first conductive semiconductor layer, the second conductive semiconductor layer, and the first conductive semiconductor layer and the second conductive semiconductor layer; A conductive support substrate electrically connected to the second conductive semiconductor layer; A contact electrically connected to the first conductive semiconductor layer; A dielectric in contact with the contact and disposed between the contact and the conductive support substrate; And an insulating layer for allowing the contact to be electrically separated from the active layer, the second conductive semiconductor layer, and the conductive support substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101974153-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101114191-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014209952-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8324649-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021194314-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9455378-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101384056-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101826979-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101830144-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20130139016-A |
| priorityDate |
2010-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |