http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100974034-B1

Outgoing Links

Predicate Object
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02052
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classificationIPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D11-00
filingDate 2003-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2010-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2010-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100974034-B1
titleOfInvention Cleaning solution and cleaning method using the same
abstract The present invention is the following general formula (1)n n n (General formula 1)n n n n n n n n (Wherein Y 1 and Y 2 represent a lower alkylene group, n represents an integer of 0 to 4, at least 4 of R 1 to R 4 and n R 5 represent an alkyl group having a phosphonic acid group and the rest) Represents a alkyl group.) A cleaning liquid for a semiconductor substrate containing a chelating agent or a salt thereof, an alkali compound, and each component of pure water, and having a metal wiring having a pH of 8 to 13, and using the same The present invention relates to a cleaning method, and even when used after a step using an alkaline abrasive or an alkaline etching solution, problems such as difficulty in gelling and removal of fine particles on the surface of the substrate or occurrence of surface roughness on the surface of the semiconductor substrate are likely to occur. Cleaning liquid capable of efficiently removing fine particles (particles) and various metal-derived impurities on the surface of a semiconductor substrate and a semiconductor using the same It provides a method for cleaning the plate.n n n Silicon Wafer, Cleaning Liquid
priorityDate 2002-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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