| abstract |
assignment n Provided is a method of manufacturing a printed wiring board which can reliably form a high height bump on a small diameter connection pad formed in an opening of a solder resist. n Resolution n By reflowing, the solder balls 77 are melted to form a high solder bump 78U from the solder balls 77 mounted in the opening 71 on the upper surface. At this time, since the distance between the solder ball 77 mounted in the opening 71 and the connection pad 158P is made close by adjusting the thickness of the solder resist layer 70, when the solder ball 77 is reflowed, The connection between the solder bumps 78U and the connection pads 158P can be reliably achieved. n n Low melting metal ball, solder resist layer, bump |