Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53228 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G08B3-1033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G08B25-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G08B5-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G08B17-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 |
filingDate |
2009-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2010-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2010-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-100971267-B1 |
titleOfInvention |
Electrolyte |
abstract |
The present invention provides an electrolyte for copper electroplating that provides improved filling of small features while reducing overplating. The present invention also provides a method of plating a substrate such as an electronic device using such an electrolyte. |
priorityDate |
2000-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |