http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100964355-B1

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filingDate 2007-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2010-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2010-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100964355-B1
titleOfInvention Eco-friendly semiconductor polishing pad composition
abstract The present invention relates to a chemical mechanical polishing composition, and more particularly, because it does not use any solvents and substances harmful to the human body, it does not provide any hazard to workers and is an environmentally friendly product, and is physically applied to the polishing composition consisting of conventional colloidal silica sol. By filtering and recirculating, it can effectively reduce large particles of 3 ㎛ or more to prevent scratches on the surface of the wafer after polishing as well as to easily remove residual particles remaining on the surface after cleaning. It relates to an environment-friendly semiconductor polishing pad composition that can be effectively utilized.n n n Chemical Mechanical Abrasives, Compositions, Eco-friendly
priorityDate 2007-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 40.