| Predicate |
Object |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate |
2007-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2010-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2010-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100954941-B1 |
| titleOfInvention |
CPM slurry composition for metal wiring formation |
| abstract |
The CMP slurry of the present invention includes a pyridine-based compound containing two or more pyridinyl groups as a corrosion inhibitor, and relates to a CMP slurry capable of minimizing dishing, erosion, and the like of a wiring layer without lowering a polishing rate. |
| priorityDate |
2006-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |