| abstract |
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive for an electronic component that is used for joining while maintaining a constant gap between electronic components. The present invention provides a highly reliable electrical device while maintaining a high accuracy between the bonded electronic components. An object of the present invention is to provide an adhesive for an electronic component that can stably and stably apply the coating using a jet dispense device. The present invention is an adhesive for electronic components for bonding electronic components, which has a spacer particle having a CV value of 10% or less, a molecular structure of 10 or less monomers having an aromatic ring in the repeating unit, and is a crystalline solid at 25 ° C, Moreover, it is an adhesive for electronic components containing the epoxy compound (A) and a hardening | curing agent whose viscosity when measured with an E-type viscosity meter at the temperature of 50-80 degreeC is 1 Pa * s or less. |