http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100944937-B1

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336
filingDate 2008-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2010-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2010-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100944937-B1
titleOfInvention Manufacturing method of semiconductor device
abstract On the substrate on which the source and drain are formed, an oxide film is formed by a chemical method, followed by NH 3 or N 2 plasma treatment to form nitrogen oxide film by doping nitrogen into the oxide film. Then, cobalt is deposited on the nitride oxide layer using an organometallic chemical vapor deposition method, followed by heat treatment to form cobalt silicide, wherein the lattice of cobalt silicide formed produces epitaxial growth consistent with the lattice of silicon.n n n n Cobalt, silicide, CVD, plasma treatment, nitrogen, doping, SiOxNy, heat treatment, buffer film, buffer layer, diffusion rate, epitaxial, porous
priorityDate 2008-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 23.