| abstract |
An ammonia-free cleaning composition for cleaning microelectronic substrates, specifically, a cleaning composition useful for and improving compatibility with microelectronic substrates characterized by an oversensitive porous low dielectric constant and high dielectric constant dielectric and copper wiring. Cleaning composition for removal of photoresist, cleaning of residues generated from organic matter, organometallic material and inorganic matter generated during plasma process, and by-products of planarization process. The cleaning composition comprises one or more ammonia-free strong bases comprising non-nucleophilic, positively charged counterions and one or more sterically hindered amide solvents. |