http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100942547-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2400-166 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04 |
| filingDate | 2006-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2010-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2010-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100942547-B1 |
| titleOfInvention | Copper foil laminated sheet composition, copper foil containing same and manufacturing method thereof |
| abstract | The present invention enables direct bonding with a polyimide metal laminate without roughening treatment, and has excellent peeling strength between the polyimide layer and the metal layer, and is suitable for a high density circuit board material. A method is proposed. The proposed composition comprises (a) 1 to 89.99 wt% of a silane coupling agent having a structure represented by the formula (R 1 O) 3 Si-R 2 -COOH; (b) 10 to 80 wt% of a metal alkoxide having a structure represented by formula M a (OR 3 ) b ; And (c) 0.01 to 50 wt% of a crosslinking compound having a structure represented by Formula (Y) 2 R 4 , wherein R 1 and R 3 is a hydrogen atom or an alkyl group having 10 or less carbon atoms, R 2 is an alkyl group having 10 or less carbon atoms as a linking group, M is a metal, and a and b in the formula are 4 or less natural numbers, and Y is -OH or- N (R 5 ) 2 , R 4 includes an alkylene group or silicon having 10 or less carbon atoms as a linking group, and R 5 represents -H.n n n n Printed circuit board, copper foil, silane coupling agent, metal alkoxide |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112646544-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112646544-B |
| priorityDate | 2006-08-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 209.