http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100930937-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4676 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-345 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-69 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-792 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-6208 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-69 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-79 |
| filingDate | 2002-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2009-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100930937-B1 |
| titleOfInvention | Thermosetting polyimide resin composition and manufacturing method of polyimide resin |
| abstract | A polyimide resin composition containing a polyimide resin and an epoxy resin, the thermosetting polyimide resin having excellent heat resistance, low dielectric constant and dielectric loss tangent, and a cured product having good mechanical properties such as tensile strength and tensile elongation. To provide a composition. The thermosetting polyimide resin composition contains a carboxyl group and a polyimide resin (X) and an epoxy resin (Y) having a linear hydrocarbon structure having a number average molecular weight of 300 to 6,000. This polyimide resin is a polyol compound having a linear isocyanate compound (a1) and a polyol compound having a linear hydrocarbon structure, and a prepolymer having an isocyanate group at the terminal obtained by reacting a polyol compound (a2) having a number average molecular weight of 300 to 6,000 in a linear hydrocarbon structure part ( It is obtained by making A) and the acid anhydride (B) of polycarboxylic acid which has three or more carboxyl groups react in an organic solvent. |
| priorityDate | 2002-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 200.