http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100925170-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0026 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-32 |
| filingDate | 2008-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2009-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100925170-B1 |
| titleOfInvention | Apparatus and method for fabricating wafer bumping template using laser |
| abstract | According to the present invention, an excimer laser having a specific wavelength is used, and in some cases, a wet etching can be used to freely process a cavity shape at a high selectivity to template materials such as glass, quartz, metal, and film. It relates to a template production apparatus and method. According to the present invention, an apparatus for manufacturing a template for forming solder bumps and transferring them to an electrode includes a laser generator for generating a laser beam, an optical system for adjusting the path and focus of the laser beam, and a laser beam passing through the optical system. The mask may be masked in a predetermined beam shape, and the cavity of the shape may be processed into a template material by using the laser beam having the predetermined beam shape passed through the mask.n n n n Template, laser processing, high processing selectivity |
| priorityDate | 2008-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.