http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100923443-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 |
| filingDate | 2007-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2009-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100923443-B1 |
| titleOfInvention | Epoxy resin composition 밀봉 for semiconductor device sealing and semiconductor device using same |
| abstract | The present invention relates to an epoxy resin composition for semiconductor element sealing and a semiconductor element sealed using the same, and more particularly to an epoxy resin composition comprising an epoxy resin, a curing agent, a curing accelerator, an adhesion improving agent, and an inorganic filler. Diamino diphenyl sulfone (Diamino diphenyl sulfone) is used as an adhesion improving agent to improve adhesion to the lead frame to provide a semiconductor device with excellent reliability.n n n Semiconductor device, adhesion, diaminodiphenylsulfone, adhesion, reliability |
| priorityDate | 2007-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 79.