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filingDate 2007-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2009-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2009-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100919079-B1
titleOfInvention Semiconductor Package and Fabricating Method Thereof
abstract The present invention is to provide a semiconductor package and a method for manufacturing the same, which can implement a fine pitch (pitch), the bumps to cushion the external impact, the mechanical properties can be improved.n n n To this end, the present invention discloses a semiconductor package including a semiconductor die having a bond pad on one surface and a bump formed on the bond pad, wherein the bump has a post and a solder surrounding the bump.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101264349-B1
priorityDate 2007-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 51.