http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100918351-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K2200-0239 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K2200-0657 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67126 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1009 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F16J15-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L27-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L27-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F16J15-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L27-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-10 |
| filingDate | 2006-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2009-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100918351-B1 |
| titleOfInvention | Sealing material for semiconductor manufacturing equipment |
| abstract | The present invention provides 80 to 50% by weight of perfluoroelastomer (FFKM) based on tetrafluoroethylene-perfluoroalkylvinyl ether, and 20 to 50% by weight of fluororubber (FKM) other than FFKM (except FFKM). + FKM = 100% by weight) relates to a sealing material for a semiconductor manufacturing device.n n n Further, according to the present invention, even when used as a sealing material of a portion which is excellent in plasma crack resistance and the like and directly or indirectly subjected to irradiation of plasma generated in a semiconductor manufacturing apparatus, the weight reduction rate of the sealing material is small, and Cracks are less likely to occur, moreover, compression set is small, and the balance of these characteristics is good, and a sealing material which can be suitably used as a sealing material for semiconductor manufacturing apparatuses is provided. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102400335-B1 |
| priorityDate | 2005-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 58.