http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100902163-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16503 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05655 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-244 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05573 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05571 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0557 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0554 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K1-0016 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
| filingDate | 2007-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2009-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100902163-B1 |
| titleOfInvention | Lead-free solder and alloy element joining method to prevent brittle fracture |
| abstract | The present invention relates to a method for preventing brittle fracture according to the interfacial reaction between the lead-free solder and the surface treatment by means of an alloying element of a metal layer of nickel or copper. More specifically, when joining an electronic component treated with nickel or copper, an alloy element (M) is added to the lead-free solder to control the composition of the lead-free solder, or by plating one element of the alloy element (M) on the nickel or copper surface. The present invention relates to a bonding method capable of preventing brittle fracture by changing a phase of an intermetallic compound produced at a junction.n n n A feature of the present invention is that in the bonding between electronic components, alloying elements of a suitable content for the surface-treated portions of electroless nickel or copper are composed of Zn, Al, Be, Si, Ge, and Mg and have one or more lead-free solders. Or by plating one of the above elements on a nickel or copper surface, it is possible to significantly increase the mechanical properties between the solder and the surface treatment by allowing new intermetallic compounds to appear instead of suppressing the formation of intermetallic compounds when reflowed. The present invention provides a method for joining an electronic component. In addition, the present invention can ensure the reliability of the electronic device by preventing the brittle fracture by inducing a change in the intermetallic compound appearing in the existing lead-free solder when soldering the electronic component and the electronic component. |
| priorityDate | 2007-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.