http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100895192-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07F1-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07F1-10 |
| filingDate | 2007-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2009-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100895192-B1 |
| titleOfInvention | Organic Silver Complexes Used in Paste for Conductive Wiring |
| abstract | The present invention provides an organic silver complex wherein an organic ligand comprising an amine group (-NH 2 ) and a hydroxyl group (-OH) is bonded to an aliphatic carboxylic acid silver (Ag) in an equivalent ratio of 2: 1 to form a complex. And a silver source selected from the group consisting of silver oxide powder, silver powder and silver flake; And an organic silver complex in which an organic ligand including an amine group and a hydroxyl group is bonded to an organic silver compound to form a complex.n n n Since the organic silver complex provided in the present invention has high solubility in solvents and is liquid at room temperature, the content of silver can be increased by using no solvent or using only a small amount of solvent in the conductive wiring forming paste. It is possible to manufacture a conductive wiring forming paste having high stability and easy industrial application without adding a separate dispersant.n n n n Organic silver complex, conductive paste |
| priorityDate | 2006-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 68.