| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a60fe79961f73bf56618fe0c95328473 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-011 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y30-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29D7-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B9-045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L25-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-16 |
| filingDate |
2008-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2009-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b5bc338f9f9d4075b0a821b3c3eef57
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_33a84c6868687ebd36089e2edfd6b95b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82eea64c7cea9e89add56e9d0b7fba7b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ddb4fc9b535ab40fbc264190bcd1ffd |
| publicationDate |
2009-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100893373-B1 |
| titleOfInvention |
High heat resistant release film for flexible printed circuit boards |
| abstract |
The present invention comprises a composition of a resin component selected from polypropylene resin, cyclic polyolefin resin or a mixed resin thereof and a modified inorganic particle having an average particle diameter of 1 to 500 nm surface treated with a higher fatty acid having 11 to 21 carbon atoms. The high heat resistant release film for flexible printed circuit boards and the high heat resistant release film as the skin layer, and the high heat resistance buffer lamination release structure having a three-layer structure having a film made of a composition of a polyolefin resin and a thermoplastic elastomer as an intermediate layer. As the film relates, the release film according to the present invention can be suitably used for a release film for flexible printed circuit board lamination process excellent in heat resistance, mold release properties, buffer properties and excellent economic efficiency. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160042533-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101766686-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101662706-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100960900-B1 |
| priorityDate |
2008-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |