http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100893279-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D9-005 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D9-00 |
| filingDate | 2006-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2009-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-04-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100893279-B1 |
| titleOfInvention | Photosensitive resin remover composition for semiconductor manufacturing |
| abstract | The present invention discloses a photosensitive resin stripper composition used to remove photoresist in the process of manufacturing semiconductor devices. More specifically, 3 to 20% by weight of the amine compound; Polar solvent 20 to 40% by weight; 0.01 to 3% by weight of a corrosion inhibitor selected from imidazoline derivatives, sulfide derivatives, sulfoxide derivatives or aromatic compounds; 0.01-5% by weight of C 2 -C 10 monoalcohol compound; And deionized water 40 to 70 wt%.n n n The photosensitive resin remover composition for semiconductors according to the present invention is modified by a photosensitive resin film cured by a hard bake, dry etching, ashing or ion implantation process, and a metallic by-product etched from the metal film at the bottom of the process. The photosensitive resin film can be easily removed at a low temperature in a short time, and the corrosion of the lower metal wiring can be minimized during the photosensitive resin removal process.n n n n Photosensitive Resin, Photoresist, Stripper, Remover |
| priorityDate | 2006-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 106.