| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aafe0172ffd94d3486c518b0709bb2b3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4223
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3218
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
| filingDate |
2007-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2009-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64cbb256d9e933cd853cdb12e1e89d3a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f633441a9ce52654d775266ffb7c7aaf |
| publicationDate |
2009-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100882336-B1 |
| titleOfInvention |
Epoxy resin composition for sealing semiconductor device and semiconductor device using same |
| abstract |
The present invention relates to an epoxy resin composition for sealing semiconductor elements and a semiconductor element sealed using the same, comprising an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler, wherein the epoxy resin is a multi-aromatic epoxy resin. And a phenol aralkyl type epoxy resin in combination with a melt silica having a content of particles having a particle size of 53 μm or more and 0.3 wt% or less as the inorganic filler, thereby providing excellent bending properties and reliability of the package, and having excellent moldability and flame retardancy. An element can be provided. |
| priorityDate |
2007-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |