http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100882060-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-351 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-58 |
| filingDate | 2007-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2009-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100882060-B1 |
| titleOfInvention | Dicing die adhesive film |
| abstract | The present invention relates to a dicing die adhesive film. In the dicing die adhesive film of the present invention, the dicing die adhesive film is laminated on the base material and the base material so as to be peeled off, the dicing die adhesive film, the die adhesive layer is a storage modulus at a temperature of 60 ℃ It is 1.0 * 10 < 6> -1.0 * 10 < 9> Pa, adhesive force in this temperature range is 5-300 gf, and melt viscosity in 140-150 degreeC temperature range is 500-5000 Pa second, It is characterized by the above-mentioned. According to the present invention, it is possible to sufficiently cover the wire bond located on the semiconductor chip during the semiconductor package process, and when two or more layers are stacked, they are interposed between dies and have excellent chip-to-chip insulation effects.n n n n Dicing die adhesive film, die adhesive layer, storage modulus, adhesive force, melt viscosity |
| priorityDate | 2007-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.