http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100877740-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67098 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-687 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67248 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate | 2007-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2009-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100877740-B1 |
| titleOfInvention | Semiconductor Plasma Processing Equipment |
| abstract | The present invention relates to a plasma processing apparatus for a semiconductor, and more particularly, a plurality of first cooling gas movement paths are formed and installed in a chamber, and a plurality of wafer seating grooves and a second cooling gas movement path are formed therethrough. A tray provided on the upper side, a wafer cover hole corresponding to the wafer seating groove to pass through to cover the upper side of the tray, a sealing member installed on the top of the chuck and the top of the wafer seating groove, and fixing the chuck, the tray and the tray cover And a cooling gas supply portion supplied by the cooling gas to the wafer seating groove of the tray.n n n According to the present invention as described above, it is possible to firmly fix the tray cover, the tray and the chuck by the clamp portion, and can shorten the working time by mounting and processing a plurality of wafers simultaneously by the tray. In addition, since the sealing members are installed in the chuck, the tray and the wafer seating groove, respectively, the cooling gas can be prevented from flowing out, thereby facilitating the temperature control of the wafer and reducing the cost, thereby improving work efficiency. have.n n n n Processing Equipment, Plasma, Wafer, Clamp, Cooling, Sealing Member |
| priorityDate | 2007-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 18.