http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100877645-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48464 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2007-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2009-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2009-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100877645-B1 |
| titleOfInvention | Semiconductor packaging structure and packaging method |
| abstract | The present invention relates to a semiconductor packaging structure and a packaging method. The semiconductor packaging of this invention is formed on a board | substrate, the board | substrate adhesion layer formed on the said board | substrate, and the said board | substrate adhesion layer, and is formed on the 1st die connected to the board | substrate by the 1st bonding wire, and the said 1st die. A semiconductor packaging structure comprising a die adhesive layer having a two-layer structure covering a first bonding wire and a second die formed on the die adhesive layer having a two-layer structure and connected to a substrate by a second bonding wire. The paste-type adhesive layer is formed so that the die adhesive layer of the two-layer structure completely covers the first bonding wire located on the first die, and a film-type adhesive layer is formed on the upper side. . According to the present invention, it has an electrical insulation effect between the die and the wire, and acts as a buffering function, which was not possible with the conventional paste type alone, to prevent peeling, cracking, and short of the die, thereby preventing damage to the die itself, and film type. It is possible to improve the filling characteristics that could not be solved by itself, and it can be expected to reduce the cost of the process itself. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9171819-B2 |
| priorityDate | 2007-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.