patent/KR-100873019-B1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100873019-B1

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1a492183be65153abfa7dec00d51c816
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01072 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13099 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02351 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05555 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05599 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3205
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
filingDate	2007-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2008-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6da42f3f0804e13890d4a271fe03ef0f
publicationDate	2008-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	KR-100873019-B1
titleOfInvention	Bonding pad to prevent peeling and forming method thereof
abstract	The present invention is to provide a bonding pad and a method for forming the bonding pad to prevent the pad filling of the bonding pad during the bonding process, the bonding pad of the present invention is an insulating film filled between the multi-layered metal film and the multi-layered metal film A bonding pad comprising: a fixing pin (a disk, a column connected below the disk, and a ball connected below the pillar) between a top metal film to be bonded among the metal films and a metal film (slit form) below the metal film. ), And the present invention described above has the effect of preventing the bonding pad from peeling during ball bonding by forming a fixing pin that is bound to the edge of the bonding pad, and the present invention is fixed Since the upper portion of the pin becomes a disk and the lower ball is fixed by the slit, there is an effect that the peeling of the bonding pad can be further prevented.
priorityDate	2007-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20000018729-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003282573-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20010062344-A
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/protein/ACCP9WKI7 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425762086 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23964

Total number of triples: 41.