http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100872162-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y30-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R13-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y10-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y30-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-097 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-322 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R13-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate | 2004-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2008-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2008-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100872162-B1 |
| titleOfInvention | Conductive Metal Nanoparticles and Nanometal Inks Comprising the Same |
| abstract | The present invention relates to conductive metal nanoparticles and nanometal inks including the same, in particular conductive metal nanoparticles comprising a hydrocarbon having a metal and a carboxyl group, a method for preparing the same, a nanometal ink including the conductive nanoparticles and the nano The present invention relates to a method of manufacturing a printed circuit board using metal ink.n n n According to the present invention, while fabricating a printed circuit board having a fine pattern, all of the manufacturing and lithography processes of the copper clad laminate (CCL) bonded to the copper foil are removed, and the wiring is directly printed on the resin film in a single process. In addition to simplifying and significantly reducing the manufacturing cost, it is possible to manufacture highly integrated and high-efficiency printed circuit boards by minimizing the wiring width of printed circuit boards, thereby providing flexibility in electronic and electric devices such as mobile phones, PDAs, and notebook computers. In forming a wiring of a printed circuit board (FPCB) or a printed circuit board of a general apparatus, by manufacturing a metal nanoparticles for forming the wiring, and by inkizing the metal nanoparticles to print them, a new method Printed Circuit Boards (PCBs) or Flexible Printed Circuit Boards (FPCBs) for industrial, office or home electrical and electronic products To a method for use.n n n n Conductive Metal Nanoparticles, Metals, Carboxyl Groups, Inks, Printed Circuit Boards |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170019156-A |
| priorityDate | 2004-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 122.