http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100867183-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
| filingDate | 2007-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2008-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2008-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100867183-B1 |
| titleOfInvention | Adhesive film for dicing die bonding, semiconductor device using same and manufacturing method thereof |
| abstract | The present invention provides an integrated or laminated dicing die-bonding adhesive film comprising an adhesive layer, an adhesive layer, or a dot / adhesive layer formed of a structure having a plurality of holes passing through an uneven structure or face; A semiconductor device manufactured using the film and a method of manufacturing the same. Specifically, the integrated or laminated dicing die-bonding adhesive film of the present invention includes an adhesive layer, an adhesive layer, or a dot / adhesive layer formed of a concave-convex structure or a characteristic structure having a plurality of holes, such as adhesiveness, pick-up property, and gap peeling property. Workability and reliability are kept good.n n n n Adhesive film for dicing die bonding, integral type, laminated type, uneven structure, hole, embossed structure, adhesive layer, adhesive layer, point / adhesive layer |
| priorityDate | 2006-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 17.