http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100860445-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_23f080b3ac5a5441b278b2351058c399 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-074 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-488 |
| filingDate | 2007-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2008-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32032b90e2707518e39962d9ae478a79 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f51f57dcc38fa61ca8d74c5030786100 |
| publicationDate | 2008-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100860445-B1 |
| titleOfInvention | Semiconductor device and manufacturing method of bond pad |
| abstract | The present invention relates to a semiconductor device and a method of manufacturing a bond pad. The technical problem to be solved is to prevent short-circuit phenomenon due to excessive re-melting of the solder deposited on the bond pad and leakage current phenomenon caused by metal peeling .n n n For this purpose, the present invention comprises a semiconductor die having an active region formed on a semiconductor substrate, an insulating layer covering a peripheral edge of the semiconductor die to expose an active region of the semiconductor die, and a bond pad formed in an active region exposed through the insulating layer, A pad is a semiconductor device formed by sequentially laminating a molybdenum layer, an aluminum layer, and a nickel layer so that a nickel layer covers the molybdenum layer and the side surface of the aluminum layer, and a method of manufacturing the bond pad. |
| priorityDate | 2007-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.