http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100859259-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1834 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-50 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-54 |
| filingDate | 2005-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2008-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2008-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100859259-B1 |
| titleOfInvention | Cobalt-based alloy electroless plating solution for cap layer formation and electroless plating method using the same |
| abstract | The present invention relates to a cobalt-based alloy electroless plating solution and an electroless plating method for forming a cap layer in semiconductor copper wiring, and more particularly, to a cobalt precursor, a tungsten precursor, a phosphorus precursor, a reducing agent, a complex forming agent, a pH adjusting agent, In a cobalt-based alloy electroless plating solution composed of a stabilizer, the reducing agent is dimethylamine borane (DMAB) or borohydride, and the stabilizer is an imidazole group, a thiazole group, a triazole group, and a disulfide group. It relates to a cobalt-based alloy electroless plating solution, characterized in that at least one selected from the electroless plating method using the same and a thin film prepared therefrom.n n n According to the present invention, it is excellent in stability and can be used many times, and the cobalt-based alloy electroless plating solution which can prevent the degradation of the film quality due to sediment, the cobalt-based alloy electroless plating method using the same and thin cobalt prepared therefrom It is effective to provide a series alloy thin film.n n n n Electroless Plating, Semiconductor Wiring, Stabilizers, Cobalt, Cap Layers |
| priorityDate | 2005-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 82.