| abstract |
An optical semiconductor integrated circuit device using a lead frame, wherein the transparent epoxy resin composition for molding the optical semiconductor includes (A) an epoxy resin; (B) hardeners; (C) thiols; And a (D) amine curing catalyst represented by the following formula.n n n Formulan n n n n n n n R 1 is a hydrogen atom (-H), an alkyl group or a phenyl groupn n n R 2 is an alkyl group (-CH 3 , -C 2 H 5 , -C 3 H 7 )n n n n Transparent epoxy resin composition, optical semiconductor integrated circuit device, optical semiconductor, surface mount, lead frame |