http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100856100-B1

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filingDate 2007-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2008-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_461c7a4fe029acaf24e98f112ab6bd8f
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publicationDate 2008-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100856100-B1
titleOfInvention Substrate surface treatment method and wiring pattern formation method using the same
abstract The present invention relates to a surface treatment method of a substrate and a method of forming a wiring pattern using the same, preparing a substrate; Treating the surface of the substrate with an aqueous KOH solution; Treating the surface of the substrate with an AgNO 3 aqueous solution; Heat treating the substrate to form an Ag thin film layer; And coating a surface of the substrate with a coating solution containing a fluoro acrylate-based compound. According to the present invention, the spreadability of the ejected ink can be suppressed and the adhesiveness can be improved when the pattern is formed by the inkjet method.
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