http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100855787-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-14 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2006-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2008-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2008-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100855787-B1 |
| titleOfInvention | Die Dicing Film for Stack Package Spacer |
| abstract | The present invention relates to a die dicing film for a stack package spacer. The die dicing film for the stack package spacer of the present invention comprises: an upper layer laminated with the wafer; An intermediate layer formed under the upper layer and acting as a buffer between the wire and the upper layer when the die is attached; And a lower layer formed below the intermediate layer and minimizing damage to the wire. The lower layer has a laminated structure having the largest viscosity of the upper layer and the smallest viscosity of the lower layer. . According to the present invention, there is no wire damage in the semiconductor stack package process, and the insulation of the wires on the upper die and the lower die is made, which is suitable for use as a specification package spacer.n n n Die Dicing Film, Stack Package, Spacer, Viscosity, Semiconductor |
| priorityDate | 2006-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 22.