| abstract |
A corundum coated with a silicone compound containing a silicone resin, a resin composition containing the corundum, and an electric device using an electronic component or a semiconductor device and transferring heat through the resin composition, wherein the resin and corundum By obtaining good affinity therebetween, when the viscosity is low and the curable resin is used as the matrix resin, a kneaded product having a uniform dispersibility and a high curing rate can be obtained to improve the handleability and moldability of the resin composition. |