http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100849572-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23H5-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23H5-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-316 |
| filingDate | 2002-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2008-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2008-07-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100849572-B1 |
| titleOfInvention | Planarization of substrates by electrochemical, mechanical polishing |
| abstract | A method and apparatus are provided for planarizing a metal layer on a substrate. In one embodiment, a substrate processing method includes forming a passivation layer on a substrate surface, polishing the substrate of an electrolyte solution, applying an anode bias to the substrate surface, and removing material from at least a portion of the substrate surface. It includes a step. In another embodiment, an apparatus provided provides for positioning a substrate in an electrolyte to form a partial sheath, an abrasive product, a cathode, a power source, a substrate carrier movably disposed on the abrasive product, a passivation layer on the substrate surface, and And a computer-based controller for polishing the substrate of the electrolyte with an abrasive product and applying an anode bias to the substrate surface or abrasive product to remove material from at least a portion of the substrate surface. |
| priorityDate | 2001-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 60.