http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100842397-B1
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f563d38cccf52408ef6e98830d2d40d8 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06733 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R3-00 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
filingDate | 2007-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2008-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c5031d8f95219fdd5086166a5b4bab4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3920bee03a13327aed8a08356ff1bf3a |
publicationDate | 2008-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-100842397-B1 |
titleOfInvention | Probe Structure Manufacturing Method |
abstract | Disclosed is a method of manufacturing a probe structure for a probe card applied to a semiconductor chip inspection equipment. In the method of manufacturing a probe structure according to the present invention, the method may include forming an opening 120 on the substrate 100, and forming a first 140a and a second seed film on the top surface and the opening 120 of the substrate 100, respectively. Forming the support part 180 on the first seed film 140a exposed to a portion of the upper surface of the substrate 100, forming the support part 180 on the first seed film 140a. Removing the partial region 144a, forming a probe 200 supported by the support unit 180 by horizontally filling the opening 120 having the second seed layer 142b formed therein, and the probe 200. Bonding the connection part 300 to the; And separating the probe 200 from the substrate 100. |
priorityDate | 2007-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.