http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100842397-B1

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f563d38cccf52408ef6e98830d2d40d8
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06733
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R3-00
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
filingDate 2007-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2008-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c5031d8f95219fdd5086166a5b4bab4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3920bee03a13327aed8a08356ff1bf3a
publicationDate 2008-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100842397-B1
titleOfInvention Probe Structure Manufacturing Method
abstract Disclosed is a method of manufacturing a probe structure for a probe card applied to a semiconductor chip inspection equipment. In the method of manufacturing a probe structure according to the present invention, the method may include forming an opening 120 on the substrate 100, and forming a first 140a and a second seed film on the top surface and the opening 120 of the substrate 100, respectively. Forming the support part 180 on the first seed film 140a exposed to a portion of the upper surface of the substrate 100, forming the support part 180 on the first seed film 140a. Removing the partial region 144a, forming a probe 200 supported by the support unit 180 by horizontally filling the opening 120 having the second seed layer 142b formed therein, and the probe 200. Bonding the connection part 300 to the; And separating the probe 200 from the substrate 100.
priorityDate 2007-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 29.