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publicationDate 2008-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-100835782-B1
titleOfInvention Resin composition for printed circuit board, composite substrate and copper foil laminate using the same
abstract (A) Polyphenyl modified by redistributing polyphenylene ether in the presence of 9,10-dihydro-9-oxa-10- (dihydroxyaryl) -10-phosphaphenanthrene 10-oxide Leneether resins; (b) a polymeric binder; And (c) a cyanate ester or a prepolymer of the cyanate ester. Moreover, this invention relates to the composite base material and copper foil laminated board which used the said resin composition.
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