http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100832823-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54453 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2103-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-0006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-354 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 |
| filingDate | 2006-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2008-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2008-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100832823-B1 |
| titleOfInvention | Device manufacturing method, dicing method and dicing apparatus |
| abstract | BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a device substrate on which a plurality of devices are manufactured and at which an alignment mark for positioning is formed, and a dicing method for positioning and dicing based on the alignment mark, and the device substrate reliably without using an adhesive tape. At the same time, it aims at enabling the positioning based on the alignment mark and improving the yield.n n n A substrate fixing step of fixing the device substrate 15 on the holder 24 to the device substrate covered with the coagulant 51 and fixing the coagulant in a solidified state, and an alignment mark 12 on the device substrate fixed on the holder. Positioning process of locally heating a partial region to melt the coagulant 51a of the partial region, observing the alignment mark through the melted coagulant, and positioning the device relative to the alignment mark, and dicing the device substrate. It has a dicing process which isolate | separates into each device element. |
| priorityDate | 2006-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 30.