| abstract |
The adhesive composition of the present invention comprises a thermoplastic resin, a radically polymerizable compound, a first radical polymerization initiator having a half-life temperature of 90 to 145 ° C for 1 minute, and a second radical polymerization having a half-life temperature of 150 to 175 ° C for 1 minute. It contains an initiator. ADVANTAGE OF THE INVENTION According to this invention, the connection structure of the adhesive composition, circuit connection material, and circuit member which can harden | cure quickly and rapidly at low temperature, and the process margin at the time of hardening process is wide and a sufficiently stable adhesive strength and connection resistance are obtained. And a semiconductor device. |