| abstract |
When sealing a some semiconductor chip with one resin sealing body, the mounting method which considered the ease of test of each semiconductor chip is proposed. Consideration should be given to various MCPs and system LSIs. Internally connect one signal output terminal of the first semiconductor chip and the first external terminal of the semiconductor device in a single package, and independently connect one signal input terminal of the second semiconductor chip and the second external terminal of the semiconductor device The connection between the signal output terminal and the signal input terminal is completed by connecting internally and the first and second external terminals of the semiconductor device to the outside of the semiconductor device. n n Motherboard, host interface, expansion memory, semiconductor chip |