patent/KR-100824571-B1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100824571-B1

Outgoing Links

Predicate	Object
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0221 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10727 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1517 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16788 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3442 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-057 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14618 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
filingDate	2007-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2008-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate	2008-04-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	KR-100824571-B1
titleOfInvention	Semiconductor devices
abstract	The semiconductor device 10 is formed on the substrate 1 having the electrode pad 1a, the IC chip 4 mounted on the substrate 1, and the electrode pad 1a, and the IC chip 4. The external connection terminal 7 which is electrically connected with the external connection terminal 7 has the resin core 7a which consists of an elastic material, and the metal layer 7b outside the resin core 7a. By having this, it is possible to provide a semiconductor device with high mounting reliability.n n n n Solder, Mounting Boards
priorityDate	2006-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419556970 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID947

Total number of triples: 39.