http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100823718-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0285 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-185 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-1006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F4-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F4-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F20-00 |
| filingDate | 2007-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2008-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2008-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100823718-B1 |
| titleOfInvention | Catalyst precursor resin composition for electroless plating in the production of electromagnetic shielding layer, metal pattern formation method using the same and metal pattern manufactured accordingly |
| abstract | The present invention relates to a catalyst precursor resin composition for electroless plating in the manufacture of an electromagnetic wave shielding layer, a method of forming a metal pattern using the same, and a metal pattern prepared according to the present invention, the catalyst precursor resin composition of the present invention comprises: an organic polymer resin; Polyfunctional monomers having ethylenically unsaturated bonds; Photoinitiators; Silver ion organic complex precursors; And an organic solvent, and a method of forming a metal pattern is formed by forming a pattern using the catalyst precursor resin composition of the present invention, and reducing and electroless plating. In the case of forming the metal pattern using the resin composition according to the present invention, the adhesion of the formed catalyst pattern layer is excellent, less catalyst loss during the wetting process, such as development or plating process, the deposition rate is improved, after electroless plating It may be formed of a uniform and fine metal pattern. In addition, the electromagnetic shielding material having the metal pattern formed by the present invention can be suitably used for forming the electromagnetic shielding film or the wiring of the flexible circuit board generated from the front surface of the display such as CRT, PDP, liquid crystal, EL and the like.n n n n Electromagnetic shielding, electroless plating catalyst, silver ion organic complex precursor |
| priorityDate | 2006-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 249.