http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100817718-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3a17dc10b5bd6e5f0df2ce1aab3bbdce |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 2006-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2008-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9e9710c40b9f4abba8e04c6722c4dbb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbdd0965f659eb6451876a76e537210a |
| publicationDate | 2008-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-100817718-B1 |
| titleOfInvention | Semiconductor device manufacturing method |
| abstract | A method of manufacturing a semiconductor device according to an embodiment of the present invention includes forming an insulating layer having a contact on a semiconductor substrate, forming a through hole having a first depth in the insulating layer and the semiconductor substrate, and forming a metal layer on the resultant. Forming a through electrode to melt the metal constituting the metal layer through heat treatment with respect to the metal layer, forming a through electrode filling the through hole, and polishing the back surface of the semiconductor substrate to expose the through electrode.n n n In accordance with another aspect of the present invention, a method of manufacturing a semiconductor device includes forming a through hole having a first depth in a semiconductor substrate, forming a through electrode filling a through hole, and polishing a back surface of the semiconductor substrate. Exposing the electrode. |
| priorityDate | 2006-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.