| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aafe0172ffd94d3486c518b0709bb2b3 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-16 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L33-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-54 |
| filingDate |
2006-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e7300e7490734f83b5d64d7cb67b81b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77d5532d8c4f72f1b12b81dd6064715b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00f1d96c48daaac4b37e2b08d9692628
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1ea374b8d3684285466ecbdd23d2fab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_956848839b24bbf531e56eb3e2068a07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65255759f7ddfc3d004832bd8a12b131 |
| publicationDate |
2008-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-100815385-B1 |
| titleOfInvention |
Composition for anisotropic conductive film |
| abstract |
The present invention relates to a composition for anisotropic conductive films comprising nano-sized silicate mineral compound having excellent heat resistance and mechanical properties. When the film is manufactured using the composition, the curable structure can be maintained at an initial low connection resistance. After assembling the electronic component, it is possible to provide an anisotropic conductive film composition capable of minimizing electrical loss by maintaining electrical connection resistance and adhesion even at high temperature and high humidity. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101097428-B1 |
| priorityDate |
2006-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |